Biofilms microbiens Avalanche breakdown Residual stress Biomasse Structure Chalcogenide glass X-ray diffraction Amyloid precursor CIGSe A-CNx B3 Solar cells Ambipolar material A1 Characterization Low-pressure plasma processing Capacitance Oxides Carbon nanotubes Biocapteurs Plasma etching AuCu alloy Chemical detection AZO thin films TEM A Chalcogenides Alloying Mott insulators B2 Semiconducting indium compounds Calcined clay XPS Buffer Couple Spectroscopic ellipsometry Chalcogenides Chalcogenide Atomic force microscopy B2 Semiconducting alloys Resistive switching Argon InP chlorine etching inductive coupled plasma ICP modeling plasma sheath simulation Transfert d'énergie Titanium dioxide B2 Quaternary Etching Bipolar resistive switching BRS Bixbyite Aryl-diazonium salts Magnetron sputtering A3 Physical vapor deposition processes Band gap C Photoelectron spectroscopy Kirkendall effect PECVD TiO2 Carbon Alzheimer's disease CHLORINE PLASMAS BOMBARDMENT Colloidal solution Sol-gel CaTiO3Pr^3^+ A Multilayers NEXAFS Mott insulator Functionalization Anatase Plasmas froids Ablation laser Sputtering Adsorption Nanocomposite Thin films AlN Amorphous Copper SF 6 Scanning electron microscopy Thin film Carbon nitride B1 Inorganic compounds Vanadium Sesquioxide Physical vapor deposition Optical properties X-ray photoelectron spectroscopy Aluminium nitride V2O3 Nanotubes A Thin films Semiconductors Transmission electron microscopy Films CNTs’ collapse B Chemical synthesis Selenization Applications industrielles Chemical and biological sensors Atomic layer etching Non-volatile memory Band alignment Carbon Nanotube Cathepsin CH4 3 nm in size